Method of bonding two structures together with an adhesive line of controlled thickness

ABSTRACT

A method of bonding two structures together with an adhesive line of controlled thickness is provided. The method includes: applying an adhesive of controlled thickness to a first surface of a first structure; at least partially curing the adhesive; applying additional adhesive to the partially cured adhesive applied to the first surface or to a second surface of a second structure; holding the first structure and the second structure in alignment with the first surface and the second surface disposed in spaced, opposing relation; applying a force to the first structure and/or the second structure to squeeze the additional adhesive between the second surface and the partially cured adhesive applied to the first surface to reduce a thickness of the additional adhesive; and at least partially curing the additional adhesive to bond the first and second structures together.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.12/144,715, filed Jun. 24, 2008, entitled “Integrated Structures andFabrication Methods Thereof Implementing a Cell Phone or OtherElectronic System”, by Eichelberger et al., which claims priority fromU.S. Provisional Patent Application Ser. No. 60/945,988, filed Jun. 25,2007, entitled “Integrated Structures and Fabrication Methods ThereofImplementing a Cell Phone or Other Electronic System”, by Eichelbergeret al., the entirety of each of which is hereby incorporated byreference.

TECHNICAL FIELD

This invention relates in general to circuit structures and methods offabrication thereof, and more particularly, to integrated structures andmethods of fabrication thereof implementing a complete cell phone systemor other electronic system, or subsystem, in a highly compact package.

BACKGROUND OF THE INVENTION

The conventional approach to electronic packaging and interconnect hasbeen to package individual integrated circuit (IC) chips into a singlepackage and to attach these packages to a printed circuit board toprovide interconnect between the individual IC chips. In recent years,this approach has met with problems of speed, size and interconnectdensity due to ever-constant demands for reduced size and increasedperformance from such integrated circuit packages.

Process speed is conventionally limited by the fact that individualpackages have loading capacitance and inductance associated with theirrelatively long pins and by the large size of conductor runs in thepackages relative to the size of the conductors of a bare IC chip. Asthe speed of computers and other devices continues to increase, theproblem of providing electronic packaging and interconnect whichprovides maximum performance has become a significant challenge. Onesolution to the problem is the multichip module (MCM). In an MCM, bare(unpackaged) IC chips are interconnected by means of a miniature printedcircuit board whose interconnect pitch may match the pitch of the ICchips themselves. There are presently two main classes of MCM. These arethe chips-last MCM and the chips-first MCM. In the chips-last MCM, theminiature circuit board is fabricated first and then the bare IC chipsare attached and interconnected to the circuit board. The method ofinterconnect is usually wire-bond or solder bump. In the chips-firstMCM, the chips are placed first relative to each other and a miniaturecircuit board is then built above the chips. The interconnect is formedto the IC chips as an integral part of the processing of the circuitboard.

Structures in accordance with the present invention fall into thecategory of chips-first MCMs. Chips-first MCMs provide one way tominimize size of a multichip module and provide high performanceinterconnect. Examples of chips-first modules are given in U.S. LettersPatents: 5,250,843; 5,353,498; and 5,841,193, each of which is herebyincorporated herein by reference in its entirety.

One problem with an assembly using chips-first technologies is thatmodules are costly to repair. If a module is fabricated with a defectiveintegrated circuit chip, then all other chips in the module are lost.Thus, it is desirable to take advantage of a chips-first technology forsize and performance aspects, while still providing a fabrication methodwhich avoids incorporating components that are not thoroughly tested andknown to be good.

Another problem in the art is to provide very thin chips-first modulesthat have mechanical rigidity and protection so that they are easilyhandled by automated assembly equipment and can be used without furtherstructural considerations by, for example, a cell phone assembler. Afurther problem is that certain components of an electronic system, suchas a cell phone, generate a significant amount of heat. An example ofthis is the power amplifier. The use of a heat sink is prohibitive inthat it adds an unacceptable thickness to the package. Instead, theconventional approach is to deliver heat to the circuit board on whichthe components are mounted. Still another problem is that in anextremely dense package, cross-talk between sensitive RF receivercomponents, powerful transmitter components and high speed digitalcomponents is markedly increased. This problem is reduced in circuitboard versions of a cell phone in that the individual components can bespaced from one another and individual shield shells placed around thecross-talking components.

The chips-first circuit structures and methods of fabrication presentedherein are directed in part to addressing the above-noted problems.

SUMMARY OF THE INVENTION

Briefly summarized, this invention comprises a method of bonding twostructures together. The method includes: applying an adhesive ofcontrolled thickness to a first surface of a first structure; at leastpartially curing the adhesive of controlled thickness; applyingadditional adhesive to at least one of the at least partially curedadhesive applied to the first surface of the first structure or to asecond surface of a second structure; holding the first structure andthe second structure in alignment with the first surface and the secondsurface thereof disposed in spaced, opposing relation; applying a forceto at least one of the first structure or the second structure tosqueeze the additional adhesive between the second surface and the atleast partially cured adhesive applied to the first surface to reduce athickness of the additional adhesive; and at least partially curing theadditional adhesive to bond the first structure and the second structuretogether.

Further, additional features and advantages are realized through thetechniques of the present invention. Other embodiments and aspects ofthe invention are described in detail herein and are considered a partof the claimed invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter which is regarded as the invention is particularlypointed out and distinctly claimed in the claims at the conclusion ofthe specification. The foregoing and other objects, features, andadvantages of the invention are apparent from the following detaileddescription taken in conjunction with the accompanying drawings inwhich:

FIG. 1 is a cross-sectional elevational view of a conventionalchips-first module;

FIG. 2 is a cross-sectional elevational view of one embodiment of amultichip module, in accordance with an aspect of the present invention;

FIG. 3 is a cross-sectional plan view of the multichip module of FIG. 2,in accordance with an aspect of the present invention;

FIGS. 4A-40 are cross-sectional elevational views of process structuresobtained during manufacturing of multichip modules, in accordance withan aspect of the present invention;

FIGS. 5A & 5B depict use of a fixture for facilitating adhesiveattachment of a process carrier to a process structure obtained duringmanufacturing of a multichip module, in accordance with an aspect of thepresent invention;

FIG. 6 is a detailed cross-sectional elevational view of one embodimentof a multichip module, in accordance with an aspect of the presentinvention;

FIGS. 7A & 7B are side elevational views of one embodiment of anapparatus for applying an encapsulant and a stiffener to the multichipmodule of FIG. 6, in accordance with an aspect of the present invention;

FIG. 8A depicts the structure of FIG. 6 with encapsulant and a stiffenerapplied thereto, in accordance with an aspect of the present invention;

FIG. 8B depicts an alternate embodiment of a multichip module having atemporary encapsulant and stiffener applied over a plurality ofinput/output contacts disposed over the front surface of the multichiplayer, in accordance with an aspect of the present invention;

FIG. 9A is a cross-sectional elevational view of the structure of FIG.8A after the removal of the process carrier and application of I/Ocontacts arrayed over the back surface of the multichip layer, inaccordance with an aspect of the present invention;

FIG. 9B is a cross-sectional elevational view of the structure of FIG.8B after removal of the process carrier and exposure of input/outputcontacts arrayed over the back surface of the multichip layer, inaccordance with an aspect of the present invention;

FIG. 10A depicts a cross-sectional elevational view of the multichipmodule of FIG. 9B after the removal of the temporary encapsulant andstiffener to expose the plurality of input/output contacts arrayed overthe front surface of the multichip layer, which is shown inverted in thefigure, in accordance with an aspect of the present invention;

FIG. 10B is a cross-sectional elevational view of multiple multichiplayers of FIG. 10A stacked and electrically interconnected in a compactpackage, in accordance with an aspect of the present invention;

FIG. 11 is a cross-sectional elevational view of an alternate embodimentof a multichip module, in accordance with an aspect of the presentinvention; and

FIGS. 12A-12D are cross-sectional elevational views of processstructures obtained during manufacturing of a multichip module, such asthe module of FIG. 11, in accordance with an aspect of the presentinvention.

BEST MODE FOR CARRYING OUT THE INVENTION

Generally stated, provided herein are numerous enhancements to multichipmodules, and in particular, to chips-first multichip modules.Advantageously, complete electronic systems or subsystems, and methodsof fabrication thereof are disclosed herein in which a second layer ofmodules or other circuit components is connected to a multichip layerfabricated as a chips-first module. The multichip layer forms a base forthe second layer of modules or components. Structures are provided formaking through connection from a front surface to a back surface of themultichip layer. Interconnect structures are provided over the frontsurface of the multichip layer for interconnecting contact pads ofintegrated circuit chips in the multichip layer, as well as forconnecting second layer components or for connecting to input/outputcontacts. The multichip modules disclosed herein include input/outputcontacts (e.g., contact pads or bumps) which may be placed at anylocation above the front surface of the multichip layer or below theback surface of the multichip layer, including over the upper surfacesand lower surfaces of the integrated circuit chips within the multichiplayer.

In enhanced aspects, structures are disclosed for providing Faradayshields, high thermal conductivity paths, power bus structures, and forstiffening the complete system or subsystem. Structures and methods forextremely thin-stacked modules are also disclosed using the chips-firstmultichip layer and featuring input/output contacts arrayed anywhereabove and below the integrated circuit chips of the multichip module.

One application of the multichip modules described herein is inproviding a complete cell phone system integrated as a single package.It is highly desirable to incorporate all of the electronics of asystem, such as a cell phone, into a single package that a cell phoneassembler can incorporate as a completely tested unit into a cell phoneby simply connecting battery and input/output means. The structure andmethods disclosed are applicable to a wide variety of systems such asBluetooth, portable computers, PDAs, stand-alone communication devices,etc. Although the concepts disclosed herein are presented with referenceto a complete cell phone in a package, it should be realized that anysmall electronic system or sub-system can benefit from the structuresand methods disclosed. In cell phone and portable electronicapplications it is desirable to provide electronic modules that are ascompact as possible, and in particular that have as little thickness aspossible. As previously stated it is also highly desirable toincorporate as much of the electronic system as possible in a singlemultichip module that can be tested before supplying the module to thesystem manufacturer. One goal then is to provide a complete system in amodule that is both thin and presents minimal footprint area.

To better understand the value of the present invention, an example ofprior art cell phone systems and prior art cell phone modules is given.Presently, cell phone manufacturers use a main circuit board and mountthe individual components or subassemblies on that circuit board.Typically the components are mounted on both sides of the circuit board.Connection is made from the I/O, such as keyboard and display, by flexcircuit or ribbon cable. The antenna is connected through an RFconnector or direct connection. The battery is also connected byindividual wires or a battery connector mounted on the circuit board. Inthis configuration, the individual packages are each relatively large.The net result is that the cell phone assembler must mount manyindividual components and packages and test each board before shippingthe phone. Ideally, if all the electronics for a cell phone wereavailable in a pre-tested module, then the cell phone manufacturer wouldhave reduced testing requirements. In addition, if that module weresmaller than the cell phone manufacturer's individual component boardtoday, it would allow for smaller cell phones and less cost to themanufacturer.

FIG. 1 is a cross-sectional view of a typical chips-first structure,generally denoted 100, showing direct interconnect between integratedcircuit chips 110 utilizing two interconnect layers (i.e., a first layer102 and second layer 104), and featuring edge to edge placement ofchips, and I/O bumps 114 above the chips. A structuralfiller/encapsulant material 116 fills the spaces between chips, providesstructural support and provides a planar surface for the interconnectlayers 102 and 104. Chips-first interconnect structures are described indetail in the above-incorporated patents. As discussed in these patents,one advantage of a chips-first structure is that interconnection is madedirectly to the chip pads 112 and therefore the interconnection takes upminimal space. The chips can be placed essentially edge to edge furtherminimizing space. Minimum thickness is achieved because the chipsthemselves may be thinned to an arbitrary thickness, and because of thedirect interconnection, there is no requirement for bumps or interposers(which would add to thickness) to connect from the chip pads to theinterconnect layers.

Since chips-first fabrication methods are batch fabrication methods, afull panel of chips-first modules can be fabricated at the same time,and thus the manufacturing process can take advantage of economy ofscale. One of the problems that chips-first modules face is that theeconomies are lost when bad chips are incorporated into the modules. Onebad chip in the module renders the module and therefore the other chipsin the module unusable. As a result, it is advantageous that theincorporated chips be thoroughly tested so that they are known to begood before they are affixed within the module. Semiconductor memory isone of the elements that are available in bare die form as “known gooddie”. Therefore incorporating memory in a chips-first base layer takesadvantage of the “chips-first” production economies, as well as minimalsize and high performance, while not suffering the fallout caused byincorporation of bad die.

As used herein, the term “chip” or “chips” includes any semiconductordevice, including a transistor or integrated circuit (e.g., those madewith silicon, gallium arsenide, silicon-germanium, indium phosphide,etc.). Further, as used herein, the term “chip” can include integrateddevices with one or more passive devices (such as resistors, capacitorsand inductors). In addition, “chip” can refer to a metal or conductivedie of any thickness, as well as to active devices (such as imagers,light sensors, photo or laser diodes, etc.). The term “chip” alsoincludes a surface-mounted component or device, such as a capacitor orresistor.

As noted, presented herein are further enhancements to the chips-firstmodule approach to packaging multiple integrated circuit chips. By wayof example, FIGS. 2 & 3 depict a cross-sectional elevational view and across-sectional plan view of one embodiment of a multichip moduleimplementing a cell phone system or subsystem as a highly integratedcompact package. This multichip module, generally denoted 200, includesDRAM 214 and FLASH 216 memory elements incorporated in a chips-firstbase or multichip layer 212. As noted, the multichip layer allows forthe most compact packaging of these “known good die” elements. Theinterconnect makes direct connection between integrated circuit chips inthe multichip layer without the use of interposers, such as solderbumps. The direct connection improves electrical performance, as well asreducing the overall thickness of the multichip module. Additionally,integrated circuit chips in the multichip layer can be placedessentially edge to edge so that the overall footprint is minimized.Input/output structures such as contact pads or solder bumps may beplaced in an array above the integrated circuit chips, thus minimizingthe area required for interconnection to the next interconnect level.

In accordance with an aspect of the present invention, a second layer ofdevices 240 is surface mounted onto multichip layer 212. In oneembodiment, these additional devices are also fabricated as chips-firstmodules, which again minimizes their footprint and thickness. The secondlayer of devices 240 includes chips of all kinds that are adapted to besurface-mounted. Device layer 240 also includes individual surface-mountcomponents (e.g., resistors, capacitors, and inductors). Device layer240 further includes surface acoustic wave (SAW) devices, piezo-electricdevices (e.g., crystals and enunciators), and magnetic elements (e.g.,speakers, transformers, and magnetic sensors). As explained above and infurther detail below, the second layer of devices 240 can also includemodules that can be chip scale packages (CSPs), conventional ball gridarrays (BGAs), and surface-mount packages, such as quad flat packs(QFPs). These modules may themselves be multi-component/device modules.

FIG. 3 illustrates how a variety of devices are surface mounted andpositioned on the multichip layer. One of the devices is referred to asApps. μP 242. This is a chips-first chip scale package (CSP). The Apps.μP 242 is a type of chip that is typically tested and additionallyburned-in in packaged form. After testing and burn-in, module 242 can beincorporated into the cell phone as a packaged module in a chips-firstCSP without impacting the yield.

A similar module referred to as a Phone μP 300 is also a chips-firstmodule that performs control functions for operation of the phone.Similarly, another type of module can be incorporated. This other typeof module is not just a single chip, but is rather a specific subsystem.FIG. 3 shows positioning of this other type of module, referred to as a“Chips-First rf/PA/Pwr Mgmt” module 250. Module 250 includes severalelectronic components and provides a sub-system with multiplefunctionalities.

FIG. 3 depicts one embodiment of the elements that make up “Chips-Firstrf/PA/Pwr Mgmt” module 250. One of these functionalities is a poweramplifier (PA) 310, which is responsible for generating the powernecessary for the phone to transmit a signal. The PA adds therequirement of removal of a significant amount of heat and also therequirement to shield generated RF noise from the rest of the system.Detailed explanation of certain techniques to achieve shielding and heatremoval are provided herein. The “Chips-First rf/PA/Pwr Mgmt” module 250also contains several other functional chips to provide the fullsubsystem function. These include a Pwr Mgmt chip 312 which controls howpower is utilized in the cell phone and helps improve battery life.Integrated passive chips 314 are also incorporated. These chips providethe functions of resistors, capacitors and inductors, and are eachconfigured as a monolithic chip for incorporation into a chips-firstmodule. Additional miscellaneous chips 316 are also incorporated tocomplete the function of the subsystem. Other components included tocomplete the entire system are conventional surface mount passives 320such as resistors, capacitors, and inductors. Surface Acoustic Wavefilters (SAW) 330 can be surface mounted directly as provided by the SAWmanufacturer. At this point, a complete system for all the electronicsof a “feature rich” cell phone have been incorporated. A preliminaryestimate shows that the entire cell phone electronics can beincorporated in a package with a footprint of 16×20 mm. By comparison, atypical circuit board containing the same electronic capability usingconventional packaging has a minimum size of 39×59 mm. The multichipmodule presented herein thus represents a savings both in size and cost.Similar size and cost savings can be obtained for other portableelectronic systems as well.

Two additional innovations can be added to the structure described inorder to further enhance the efficacy of the cell phone in a packagepresented herein. If the module is to be provided to the cell phoneassembler in a way that it is most easily assembled into a system, itshould have a means for easy interconnection to the keyboard, battery,antenna and display. FIG. 2 shows a configuration where bumps 222 areprovided on the back surface of, multichip layer 212. Cell phoneassemblers are set up to handle components that can be surface mountedby soldering means. Bumps 222 are connected to the rest of the system bya redistribution layer 224 (which may comprise one or more metal levels)that redistributes signals from an array of bumps to conductivestructures or through connects in the filler encapsulant material 226.

A second innovation that improves efficacy of the system is the additionof an encapsulant and stiffener or stiffening member (which is planar inone embodiment) to the side away from the bumps. This stiffener addsrigidity and protection to the module, and makes handling of the moduleeasier since one of the main surfaces is flat. In addition, the addedrigidity eliminates any requirement for the assembler to add a separatemeans to stiffen the module. FIG. 2 shows the incorporation of anencapsulant 248 that also provides stiffness and a uniform handling andprotective surface.

Still referring to FIGS. 2 & 3, the thickness of the multichip module200, that is, of the complete cell phone in a package in this example,containing all electronics and including the thickness of the bumpinterconnect 222 and the stiffener/encapsulant 248, is (in oneembodiment) advantageously less than 1.6 mm. The description belowdetails methods of fabrication of the above-described multichip module,as well as details of various alternate embodiments thereof. While theadvantages are described herein in terms of a cell phone any electronicsystem or subsystem can benefit from the disclosed methods andstructures.

Fabrication of Chips-First Base Layer

FIGS. 4A-4O show various process steps to achieving a chips-first baselayer (also referred to herein as a multichip layer or a chip layer).Referring to FIG. 4A, an alignment carrier assembly 401 is provided inwhich a film 400 comprising a polyester film 406 and UV release adhesive408 is adhesively bonded to the alignment carrier. In one embodiment, aUV release film such as Adwill D218 Available from Lintec of Tokyo,Japan, is laminated to a plain glass plate 402. U.S. Pat. No. 7,112,467B2, entitled “Structure and Method for Temporarily Holding IntegratedCircuit Chips in Accurate Alignment”, which is hereby incorporatedherein by reference in its entirety, describes fabrication ofchips-first modules using such an alignment carrier. In that patent, asecond adhesive is applied to the back of the exposed side of the UVrelease film and IC chips are placed face down into that adhesive. Inthe fabrication of the chips-first base layer of the present inventionadditional steps are added. In particular, structures such as throughconnects, bus bars, thermal conduction paths, and Faraday shields areprovided integrated within the chips-first multichip layer.

After lamination of the UV release film to the glass plate, copper 404is sputtered onto the exposed surface of the UV release film. In oneembodiment, the actual sputtering operation includes providing a verythin adhesion layer of titanium. Sputtering is well known in the art. Byway of example, the thickness of the titanium is 400 angstroms followedby 4000 angstroms of copper. In an alternate embodiment, a film that hasUV release adhesive on one side and metallization pre-coated on theother side could be laminated to the glass plate. This saves the step ofsputtering the individual panels. FIG. 4A shows an alignment carrierwith UV release film bonded to a glass plate with copper coated on thefilm.

Referring to FIG. 4B, a thick resist layer is spray coated over thesputtered copper. The resist 410 is then exposed and developed to formopenings 412, 412′ in the resist. Thick resist materials with excellentaspect ratios are well known in the art and can be supplied in bothpositive and negative acting form. The pattern of resist openingsdetermines what copper structures will be provided. By way of example,through vias are provided by small round openings. Faraday shieldstructures are provided either with a frame-like opening that willsurround the device to be shielded or by a “picket fence” of closelyspaced round openings. Thermal slugs are provided by a rectangularopening 412′ in the appropriate location. FIG. 4B shows the patternedresist 410 with openings 412, 412′ disposed over the copper coated UVrelease film. Copper is then electroplated to the thickness required bysubsequent processing steps, generally to the final thickness of theencapsulant/filler which will be added in subsequent processing. Theresist is then removed. After all resist is removed, the sputteredcopper and titanium is removed by etching the copper in ammoniumpersulfate and etching the titanium in 5% TFT Etchant in DI water. TFTEtchant is available from Transene Corp. Rowley, Mass.

FIG. 4C shows the copper structures formed on the alignment carrier.Through connects 420 are cylinders that will provide a conductive pathfrom the top to the bottom of the structural filler material. TheFaraday shield structure 426 will form a copper enclosure for one ormore devices that create or are sensitive to RF noise. The Faradayshield enclosure will be completed by subsequent processing of top(i.e., interconnect) and bottom (i.e., redistribution) layers discussedbelow. Thermal slug 422 provides a highly thermally conductive pathbetween the top and bottom of the multichip layer.

Referring to FIG. 4D, a chip attach adhesive 430 is next applied to theexposed side of the UV release tape. This adhesive is, in oneembodiment, an adhesive that can be cured by UV light, although othertypes of adhesive may be used. Details of using a UV release tape and UVcurable adhesive are given in U.S. Pat. No. 7,112,467 B2 incorporatedabove. The adhesive can be spray coated to the UV release film and driedof solvent at 50-75° C. for a period of 30 minutes in a forced hot airoven. By way of example, thickness of the adhesive is 3 to 6 microns.Chips (e.g., Chip1, Chip2, Chip3, Chip4 & Chip5) are placed face downinto the UV curable adhesive 430. The UV curable adhesive is exposed toUV light, e.g., 500 mJ/cm² at a fluence of 5 mW/cm². This particularmaterial is air inhibited at the above fluence level such that it onlycures under the chips where the air is excluded. After exposure, theadhesive is developed away in a spray developer using propanol as adeveloper. In an optional embodiment, the alignment carrier is providedwith a masking pattern 435 that aligns openings with the placement ofthe chips. By exposing with a collimated UV source, the area under thechips is exposed while the area away from the chips is completelyunexposed. This also has the advantage that alignment marks can beprovided which allow for extremely accurate alignment of the chips onthe alignment carrier.

FIG. 4D shows the alignment carrier assembly 401 with chips (Chip1,Chip2, Chip3, Chip4 & Chip5) positioned face down, with their contactpads 431 in the adhesive 430, and with the adhesive developed away inareas not under the chips. The alignment carrier is also provided with amasking pattern 435 that corresponds to the positioning of the chips.This masking pattern may be provided by the same processes that are wellknown for the formation of chrome on glass photomasks.

Referring to FIG. 4E, in a further optional embodiment a secondsputtering step can be performed which covers the backs of chips andother exposed surfaces with a seed layer of copper 440. A resist iscoated and patterned with openings at least partially over the backs ofselected chips, and optionally, at least partially opening the resistover the alignment carrier region adjacent to selected chips. Resist 441is shown with openings 442. Electroplating builds up the copper andforms thermal slugs 445 or high conductivity shells 446 around the chipfor low inductance back-side connection or Faraday shielding. When theresist opening is over the film 406 of the alignment carrier assembly, abus bar 447 is formed.

FIG. 4E shows the patterned resist with a second metal plated in theresist openings. At this point the resist is stripped and the copperseed metal is etched. FIG. 4F shows the chips adhesively bonded to theUV release film as well as the metallization structures formed by thefirst and second metallization steps.

Exposed chip surfaces, the copper structures, and the adhesively bondedfilm are next cleaned by wet cleaning and plasma etching followed byappropriate adhesion promotion steps to adhesion promote the copper aswell as the chip surfaces.

Filler/encapsulant, such as a liquid epoxy resin, is added to the moduleto cover all exposed surfaces on the back. To increase strength andimprove the expansion match of the filler/encapsulant (i.e., thestructural material) to that of the silicon chips, thefiller/encapsulant can be loaded with an inert powder such as alumina orglass particles. The filler/encapsulant can be poured or dispensed ontothe alignment carrier, or the alignment carrier may be covered at itsouter edges or other locations on the carrier with a mold form andinjection molded, or covered with a frame and frame molded. In oneembodiment, the filler is dispensed by a liquid dispensing machine suchas a CamALot Dispensing Machine available from CamALot Division ofCookson Electronic Equipment located in Franklin, Mass. The dispensingmachine accurately dispenses the relatively high viscosity loaded epoxyto the edge of the alignment carrier. The viscosity keeps the fillerfrom flowing off the carrier. This eliminates the need for molds orframes in the fabrication process. Alternatively, a mold may be used ifit is required to contain the filler/encapsulant in cases whereviscosity is low or where injection molding is used.

In one embodiment, a two-part epoxy system which can be cured at or nearroom temperature is used. The cured filler/encapsulant is then lapped tothe appropriate thickness. In one embodiment, the filler and chips arethinned to a minimum thickness. This thickness is in the range of 50 to100 microns. It is possible to go thinner than that thickness, but thereis a tradeoff between lapping speed and final chip thickness. The finerthe grit size the slower the lapping rate, but thinner chips can be madeand still not be damaged. Noting that the chips are rigidly held by thealignment carrier, there is no penalty in going very thin except theeconomy of lapping very slowly or using multiple grit sizes. In anyevent, the lapping exposes the through connects and thermal slugs forfurther processing. Alternatively, if the chips are adequately thinnedbefore application of the filler/encapsulant, then thefiller/encapsulant can be lapped to a thickness that is greater than thechips, but that still exposes through connects and thermal slugs.Practical molding techniques could also achieve this without a lappingstep to thin the filler/encapsulant.

FIG. 4G shows both of these cases in cross section in the same multichiplayer. Note that Chip1 is thinner than the final thickness of thefiller/encapsulant 450. The filler/encapsulant covers the back of thischip as well as the sides. The area of encapsulant that is thicker thanChip1 is denoted 451. Chip2 and Chip3 are thinned during lapping offiller/encapsulant 450, and thereby are the same thickness as thefiller/encapsulant, so that filler/encapsulant only contacts the sidesof these chips. Likewise, Chip4 and Chip5 have copper structures thatare partially thinned with the filler/encapsulant lap and are therebythe same thickness. Note also that the through connect 420, Faradayshield 426, thermal slug 422, backside thermal slug 445, and lowinductance backside connect 446 structures are uncovered by the lapoperation so that electrical or thermal connection may be made to thesestructures.

Adding Redistribution Interconnect

In the next processing steps, one or more redistribution interconnectlayers (generally referred to herein as the “redistribution layer”) areprovided that connect the exposed copper to other locations on thebottom of the multichip layer. Alternative processing is used dependingon the desired structure.

In one optional but novel embodiment, copper is sputtered over theexposed back surface. The actual sputtering operation includes providinga very thin adhesion layer of titanium. Sputtering is well known in theart. By way of example, the thickness of the titanium is 400 angstroms,followed by 4000 angstroms of copper. Next, a resist layer isspray-coated over the sputtered copper. The resist is then exposed anddeveloped to form openings in the resist. Resist materials withexcellent aspect ratios are well known in the art and can be supplied inboth positive and negative acting form. The pattern of resist openingsdetermines what copper structures will be provided. Next, copper iselectroplated in the openings (for example, to a thickness of 3 to 12microns). The resist is then removed by methods well known in the artand depending on whether a positive or negative resist is used. This isfollowed by removal of the sputtered copper and titanium seed layer byetching the copper in ammonium persulfate and etching the titanium in 5%TFT Etchant in DI water. TFT Etchant is available from Transene Corp.,of Rowley, Mass. FIG. 4H shows the resulting structure. Two copperstructures are fabricated. Copper structure 456 covers all of the backof Chip3 and extends beyond the chip to the filler/encapsulant material.This structure provides a strengthening function by bridging from thechip to the filler/encapsulant. When the modules are in final form,stress is induced on the interface between the chip edge and thefiller/encapsulant. The copper strengthening member securely holds thisinterface together. Copper structure 457 provides the same strengtheningfunction and additionally connects electrically from the back of thechip to a through-connect. Structure 458 provides a strengtheningfunction by bridging from the copper covered back of Chip4 to thefiller/encapsulant. The strengthening function is especially valuable asthe overall thickness of the module is decreased. Throughout theremaining discussion, structures 456, 457 and 458 may be left in placeor, optionally, the steps outlined above may be eliminated withoutimpacting the other structures to be described. In the interest ofclarity, optional structures 456, 457 and 458 are not shown.

In one embodiment, a dielectric is added to the back side and openingsare provided in the dielectric. The dielectric is applied as a liquid,dried and then hardened in all areas except the openings by exposing thematerial through a photomask with collimated UV light. As an example,the material is a low modulus high elongation dielectric such asdescribed in U.S. Pat. No. 6,426,545 B1, entitled “Integrated CircuitStructures and Methods Employing a Low Modulus High ElongationPhotodielectric” which is incorporated herein by reference in itsentirety. Details of suitable processing and material formulations areexplained in U.S. Pat. No. 6,426,545 B1, which is hereby incorporatedherein by reference in its entirety.

FIG. 4I shows a dielectric layer 460 with patterned openings 461overlying the copper structures exposed by the above mentioned lappingsteps. The advantage of using a low modulus high elongation material isthat it relieves the stress caused by a mismatch in expansioncoefficient between the module and the circuit board to which it isattached. This allows the solder balls or contact bumps to be muchthinner than would be required with a rigid dielectric. Alternatively,other photo-patternable and non photo-patternable in situ formeddielectrics such as epoxy or BCB could be used. In addition, a fullycured material (such as polyimide) may be adhesively bonded in place toform the dielectric layer. For example, kapton polyimide may beadhesively bonded in place to form the dielectric layer. In cases wherethe material is not photo-patternable, the openings can be formed bylaser ablation or by reactive ion etching. Both techniques are wellknown and suitable parameters for the polymer dielectrics describedabove are described in the via formation discussion of theabove-incorporated U.S. Pat. No. 5,250,843. Alternatively, if theencapsulant is thicker than the associated chips as depicted by area451, then the encapsulant may be used as the dielectric layer.

FIG. 4I shows the patterned dielectric with openings as described above.Note that Chip1 is thinner than the filler/encapsulant so that theencapsulant itself may act as an insulating dielectric. In FIG. 4I, theopening in the dielectric 460 extends entirely over the area aboveChip1. In this way, both the dielectric and filler/encapsulantstructures may be fabricated at the same time. Next, a seed layer ofcopper is sputtered over dielectric 460 and into the openings 461. Inone embodiment, the actual sputtering operation includes providing avery thin adhesion layer of titanium. Sputtering is well known in theart. Thickness of titanium may be 200 angstroms followed by 4000angstroms of copper. A resist layer is spray coated over the sputteredcopper. The resist is then exposed and developed. Resist materials withexcellent aspect ratio are well known in the art. The pattern of resistopenings determines what copper structures will be formed. One exampleis an interconnect that distributes from the exposed through connectionsto positions where connection pads or bumps are to be disposed.

Faraday shield structures are provided by an opening that definesmetallization behind the chip and also connects to the previouslydefined Faraday shield structure in the filler/encapsulant. Connectionsto the back side of chips are provided by openings behind exposed chipsurfaces and patterns to the through connects. Thermal slugs areprovided by an opening located over the backs of chips. Thermalcontinuation slugs can be provided by openings over the copper slug infiller/encapsulant previously provided. The copper is electroplated tothe thickness required by subsequent processing steps. For example, thecopper may be plated to a thickness of 6 to 12 microns. The resist isremoved by methods well known in the art and depending on whether apositive or negative resist is used. A second layer of resist is appliedand patterned to provide built up copper in the area where I/O pads, orI/O bumps are desired and also in the areas where thermal slugs aredesired. Copper is electroplated to a thickness of, for example, 12 to50 microns to accommodate the various structures described. The secondlayer of resist is removed followed by removal of the sputtered copperand titanium seed layer by etching the copper in ammonium persulfate andetching the titanium in 5% TFT Etchant in DI Water. TFT Etchant isavailable from Transene Corp. of Rowley, Mass.

FIG. 4J shows a cross section of the structure with patterned copper forredistribution from the through connects to I/O structures such as bumpsor pads, connection to the back side of components, thermal slugsthrough the filler/encapsulant and also to the back of chips, and directpatterning of redistribution on the filler/encapsulant. Patterned metal465 redistributes connection from a through connect 420 to an I/O pad466. This redistribution is insulated from Chip1 by thefiller/encapsulant itself area 451. Patterned metal 467 redistributesfrom a through connect 420 to an I/O pad 468. Redistributioninterconnect 469 makes electrical interconnection from I/O pad 470 tothe back of Chip4 by contacting electrical contact and thermal slug 445(see FIG. 4G). A high conductivity thermal path is shown by the platedarea 472 which directly contacts metal 469 and slug 445. Theredistribution interconnect provides a capping structure 473 on thebottom side of the enclosure contacting Faraday shield structure 426.Through this structure, the back of Chip3 is covered by the cappingstructure 473 and the sides are covered by metallization 426 in thefiller/encapsulant. Pad 474 provides electrical connection to theFaraday shield structure. Redistribution metallization 475 makesinterconnection from through connect 420 to the back of Chip2 as well asto pad 476. Note also that thermal connection is also provided from theback of Chip2 to thermal slug 476. A high thermal conductivity path isprovided through the filler/encapsulant 450 by the combination ofplating structures 477, 478, making contact to thermal slug 422.

Attaching Process Carrier and Initiating Processing on Top Side

At this point, processing on the top of the chips-first structure may beinitiated. This is begun by attaching a process carrier to the back,which will facilitate handling of the very thin chips-first structure.It will also maintain accurate spacing between chips and will facilitateprocessing alignment when processing large panels. FIG. 4K shows aprocess carrier 481 attached to the multichip layer of FIG. 4J byadhesive 482. This process carrier is (in one embodiment) a plain glasspanel that has been slightly roughened on one side to improve adhesion.The dielectric and metal on the module attached to the alignment carrier(as shown in FIG. 4J) is pre-coated with a layer of adhesive. In oneembodiment, a high temperature epoxy that can be cured at or near roomtemperature is used. This material is coated to a thickness of, forexample, between 12 and 50 microns by spin or spray coating. Thematerial is cured until solid but not completely cured. An epoxy thatcures in 24 hours at room temperature is coated then baked on a hotplate for 30 minutes at 75° C. to achieve this solid, but not fullycured objective.

The next steps of the process may be understood with reference to FIGS.5A and 5B. These figures show a representative module 512 attached to analignment carrier assembly 510 with a partially cured adhesive 514coated to the back side of module 512. Next, the process carrier 500 andalignment carrier assembly 510 are bonded by low adhesion tape 520 and521 into open frames 530 and 531. Such a process is well know in the artfor the purpose of holding wafers when they are diced by a dicing saw. Aframe bonder that is suitable for this use is sold by SemiconductorEquipment Corp. of Moorpark, Calif. Various sizes and configurations canbe supplied to accommodate different size substrates and to allowcontact or non contact to the front face of the taped substrate. Lowtack tape is also available from the same company. The frames areavailable from the companies that sell dicing saws. A suitable dicingframe may be purchased from Disco Corp. of Tokyo, Japan. Frames to 300mm or larger are available. The process carrier frame 530 is then placedon a fixture 550 that holds the frame in alignment by way of alignmentpins 552 and thereby holds the process carrier in alignment. The sameliquid, high temperature epoxy adhesive 516 is then applied to thecenter of the process carrier. The alignment carrier frame 531 is placedon the same fixture such that the two untaped surfaces face one another.

Referring to FIG. 5B, the fixture 550 is then placed into a laminatingpress and pressure is applied. This squeezes the adhesive into a thinuniform film 516′ and bonds the process carrier 500 to the bottom of thepartially processed chips-first base 512. The total glue line thicknessis primarily dictated by the thickness of the pre-applied and partiallycured coating 514. After the adhesive has bonded the process carrier 500to the chips-first base 512 the fixture is removed from the laminatingpress and the low tack tape 520 and 521 is removed from both thealignment carrier and the process carrier. The low tack tape and framethus serve the dual purpose of holding the process carrier and alignmentcarrier in alignment and also containing any run off of the adhesive.

Returning to FIG. 4K, the process carrier 481 is shown attached to thepartially processed chips-first base 480, which is still attached to thealignment carrier assembly 401. At this point the alignment carrier isseparated from the partially processed chips-first base. This is done byexposing the adhesive 408 to UV light which decreases the adhesion ofthe UV release tape to the glass alignment carrier. It should be notedthat this exposure of the release tape to UV light can be done anytimeafter the tape has been laminated to the alignment carrier. The residualadhesion is sufficient to maintain accurate positioning through thesubsequent processing steps. In fact, in the case where the alignmentcarrier has a mask 435, as described above, it is necessary to exposethe UV release tape before the opaque filler/encapsulant is applied.This exposure is from both sides since the mask prevents light fromreaching some significant areas from the masked side. The alignmentcarrier can be easily removed by prying from a corner. Moderate heatingof the assembly at this point aides the removal process as it slightlysoftens the adhesives and makes separation easier. Additionally, theremoval process is aided by making process carrier 481 just slightlysmaller than the alignment carrier. This prevents the adhesive that issqueezed out during the lamination operation from adhering to thealignment carrier edges. If the adhesive does contact the edge of thealignment carrier it bonds the two carriers and the edges and hampersseparation. The separation occurs at the UV release adhesive 408 toalignment carrier glass 402 interface and therefore leaves the UVrelease film attached to the top of the partially processed chips-firstmodule. At this point, a corner of the film is engaged and peeled in a90 degree peel. This whole process works because of the differencebetween the adhesion over the area of chips and the adhesion of the filmthat is being peeled. It should be noted that the adhesion is quitesufficient to hold the chips in accurate position due to high shearcapability of a thin glue line over the area of the chips. When a 90degree peel is initiated the adhesive gives up readily as the adhesiveforce of the very thin adhesive is spread over a concentrated area ofthe bend point of the peel.

Any residual adhesive left on the chips is now cleaned off The firststep is to soak the structure in acetone which lifts the cured adhesivefilm from the tops of the chips. The second step is a light plasma etch,with either O₂ or O₂/CF₄ (70/30) to remove any residual adhesive thatwas not removed by the acetone soak. The final step is cleaning by wetprocessing which removes any residual ions such as sodium and chloridefrom the surface of the chips. FIG. 4L shows a cross-sectional view ofthe chips-first base ready for application of the one or moreinterconnect layers (generally referred to herein as the “interconnectlayer”) above the chips. Note that the top of the through connects 420,copper bus bars 447, copper Faraday shielding layers 426, low inductancechips backside connection 446, and thermal slug 422 are exposed, as wellas pads 431 of the chips.

Adding the Interconnect Above the Chips

In one embodiment, the interconnect layer starts with a layer of lowmodulus high elongation dielectric containing openings down to pads ofthe chips and down to the copper through connects and copper bus bar.This dielectric is applied as a liquid, dried and hardened in all areasexcept the openings by exposing through a mask with collimated UV light.Details of processing and formulations of low modulus high elongationdielectrics are again given in the above-incorporated U.S. Pat. No.6,426,545 B1.

Alternatively, other photo patternable and non photo-patternable in situformed dielectrics such as epoxy or BCB could be used. In addition, afully cured material such as kapton polyimide may be adhesively bondedin place to form the dielectric layer. In cases where the material isnot photo-patternable, the openings can be formed by laser ablation orby reactive ion etching. Both techniques are well known and suitableparameters for the polymer dielectrics described above are described inthe above-incorporated U.S. Pat. No. 5,250,843.

Next, a seed layer of copper is sputtered over the dielectric and intothe openings to make connection to the IC chip pads and other copperstructures in the encapsulant. In one embodiment, the actual sputteringoperation includes providing a very thin adhesion layer of titanium.Sputtering is well known in the art. The thickness of titanium may be200 angstroms, followed by 4000 angstroms of copper. A resist layer iscoated over the sputtered copper. The resist is then exposed anddeveloped. Resist materials with excellent aspect ratio are well knownin the art. The resist is patterned with openings where the copperinterconnect runs are desired. The copper is then electroplated to thethickness required by subsequent processing steps. A thickness of 6 to12 microns may be used. The resist is removed by methods well known inthe art and depending on whether a positive or negative resist is used.The sputtered copper and titanium is removed by etching the copper inammonium persulfate and etching the titanium in 5% TFT Etchant in DIwater. TFT Etchant is available from Transene Co. of Rowley, Mass. Inthe area where a thermal slug is desired two alternatives may be used.Without adding any processing steps the area above the thermal slug thatgoes through the filler/encapsulant can be patterned with tightly spacedvias at the same time that the rest of the interconnect is patterned.For maximum performance, an additional resist step can open an areaabove the thermal slug as was done on the other end of the slug. Again,copper is electroplated and resist removed. After removal of resist, thesputtered copper and titanium is removed by etching the copper inammonium persulfate and etching the titanium in 5% TFT Ecthant in DIwater.

Additional interconnect layers can be patterned by repeating the stepsof applying dielectric, patterning openings in the dielectric,sputtering copper, applying photo resist, patterning the resist,electroplating the copper and stripping the resist and etching thesputtered seed layer. FIG. 4M shows a cross section of two layers ofdielectric and interconnect. Dielectric1 485 with Metal1 486 makesdirect connection to the exposed areas shown in FIG. 4L. Dielectric2 487with Metal2 488 forms additional interconnect structures. Interconnectin area 490 completes the Faraday shield enclosure. Specifically,capping structure 473 forms the bottom/top of the enclosure and makesconnection to the Faraday shield side structures 426. Structures 426 liein the filler/encapsulant 450 and surrounds Chip3 on the sides. Cappingstructure 490 completes the enclosure above/below Chip3 and makesconnection to the top end of Faraday shield side structures 426. Acomplete ground enclosure is thus formed at the same time and with thesame processing steps as the through connects and other interconnect andredistribution layer interconnects.

A high conductivity path through the filler/encapsulant 450 is providedby structure 491 connected to slug 422 and back side elements 477 and478. This thermal path facilitates heat removal from a device to besoldered in place above. Interconnect structure 492 providesinterconnection to the bus bar 447. Interconnect structure 493 makesconnection from a through connect 420 to chip pads 431 of Chip1 showingdirect connection from a chip to the other side of thefiller/encapsulant. When all interconnect layers are completed, thereare two possible finishing steps depending on the final use of themodule. In one embodiment, a solder mask is applied, for example, byspray coating. Solder mask type LP2 available from Rogers Corp. ofChandler, Ariz., may be used. The mask is coated, for example, to athickness of 25 microns. Mixing, coating drying, exposure, development,and post bake are all done in accordance with the specifications of themanufacturer. Openings in the solder mask expose the solder landing padsfor surface mounting of components, and for attachment of heat removalslugs associated with components requiring heat removal through thechips-first base. FIG. 4N shows the structure of FIG. 4M with soldermask 494 added and openings for electrical connection 495 and thermalconnection 496.

In an alternative embodiment, it is desired to have no solder mask atthis point, but rather have an array of solder landing pads. This isaccomplished by stripping the resist when the final layer is processed,then applying another layer of resist and patterning holes where thesolder landing pads are desired. Copper is electroplated to form thepads followed by stripping the resist and etching the seed layer. FIG.4O shows this alternative structure generally denoted 499. Land pads 497are for electrical connection and pads 498 are for thermal connection.

At this point, the chips-first base portion of the structure of FIG. 4Nor 4O can be tested. The advantage of testing at this stage is that ifthe interconnect or components in the chips-first base layer for a givenmodule are found to be defective, then further population of that modulewith additional components can be halted. This way the value of theunpopulated components can be saved by not associating them with anultimately defective module.

Adding Devices of the Second Layer

The devices of the second layer are next added. Starting with the moduleof FIG. 4N, solder paste is screen printed onto the base layer overopenings 495 and 496 in the solder mask. Stencil printing solder pasteis well known in the art. Second layer devices are placed with theirbumps or pads disposed within the solder paste. The assembly is placedinto a reflow oven and heated on a rapid ramp to just above the meltingpoint of the solder, which melts the solder to complete the electricalinterconnection between the second layer devices and the chips-firstbase layer.

FIG. 6 shows the chips-first layer with second layer devices attachedelectrically 662 and thermally 664. Note that a thermal conduit isformed under a thermal slug of the second layer devices by soldermelting to provide an all metallic path for heat flow from the secondlayer devices through the structural encapsulant of the chips-firstbase. Although one mode is to use solder to interconnect the chips-firstbase to second layer interconnect, it is also possible to screen printconductive epoxy, and then place the bumps or pads of the second layerdevices into the conductive epoxy and cure the conductive epoxy. Anothermethod is to dip the solder bumps of some or all of the second layerdevices in flux and place them bumps down on the chips-first base.Solder paste is not required where flux dipped bumps are used. The samereflow process that was used to reflow the solder paste can at the sametime reflow bumps that are just flux dipped. This method is of valuewhen stacks of devices are assembled since it is difficult to printsolder paste on an uneven surface. It should also be noted that the useof the high elongation low modulus dielectric on the chips-first baseand/or over the second layer devices allows the solder bumps to beextremely thin. This is because substantially all the strain is taken upin the dielectric and little strain is transmitted to the bumps. Thisallows the structure to be considerably thinner.

In the example shown in FIG. 6, two bumped modules are illustrated aspart of the second layer. It should be understood that there are a vastvariety of modules that could be used, such as: chip scale packages,conventional bumped packages and modules, stacked packages, bumpedchips, SAW modules and essentially any device that may be surfacemounted to a circuit board. Additionally one or more of the incorporatedmodules could be a subsystem module which was previously fabricatedaccording to this application. One of the modules 670, which isrepresentative of a generic module and could be any of the abovementioned modules, includes solder bumps or pads that interconnect themodule to the multichip layer.

Module 680 is depicted as a module optimized for heat removal. Such amodule may be formed by the processing steps disclosed herein. Some ofthe salient internal structure of this module is shown in FIG. 6. Chip684 is mounted such that the back side is connected to thermal slug 682,which allows both electrical and intimate thermal contact to chip 684.Structure 684 makes connection from the top chip pads 685 to bumps/pads662 on the bottom of the module. A continuous highly thermal conductivepath is provided by copper slug 682, solder bump 664, structure 616,slug 422 and the back side structures 477 and 478. To further generalizethe structure, a surface mount component 690 is shown. This componentrepresents components such as resistors, capacitors, inductors, crystalsetc. that are required in a complete system and not incorporated in oneof the integrated modules.

Adding Encapsulant and Stiffener

In one embodiment, an encapsulant layer is added to provide mechanicalrigidity to the module and to provide a flat surface for improvedhandling by automated equipment. The encapsulant may be added alone orwith a rigid stiffening member. Using the rigid stiffening member isadvantageous if the module is to be of minimum thickness since practicalencapsulants are not as stiff for a given thickness.

FIGS. 7A and 7B show a laminating fixture suitable for moldingencapsulant and bonding a stiffener to the module. The fixture consistsof two plates 700 and 702 held apart by fine adjustment screws 704. Anarrangement 710 is provided that forces the two plates together undermoderate pressure either by pneumatics or by springs. Alignment studs706 hold the top and bottom plates in alignment. Vacuum hold down holes712 are provided in each plate for maintaining alignment of the parts tobe molded.

With reference to FIG. 7B, both the stiffener 722 and a chips-firstmodule with second layer devices and components 724 (similar to themodule shown in FIG. 6) are laminated with low adhesion tape 720. Thisis done to contain the encapsulant runoff. Tape lamination can be doneusing a roll laminator from Think & Tinker, Ltd. of Palmer Lake, Colo.,and a low tack tape such as available in various sizes and thicknessfrom Semiconductor Equipment Corp. of Moorpark, Calif. Encapsulant isapplied to both the stiffener and module. By way of example, theencapsulant material is one that contains a curing agent, and can beapplied in liquid form, such as an epoxy or a urethane acrylate.Applying the material in liquid form allows it to run under the attachedsecond layer modules and allows entrapped air bubbles to flow out. In analternative embodiment, conventional underfill material is dispensed andallowed to flow under the modules by capillary attraction. Thisunderfill is cured before the encapsulant is applied. The use ofunderfill is well known in the art.

The encapsulant material 726 is applied and dried. The stiffener 722mounted on low tack tape 720 is attached to the upper plate of thefixture. This can be done by incorporating vacuum hold down in thefixture plate or by applying a thin layer of low tack adhesive or both.Similarly, the module 724 mounted on low tack tape 720 is attached tothe bottom of the fixture. The top and bottom plates are assembled withthe module facing up and the stiffener facing down. Pressure to forcethe plates together is applied and the fixture is heated to atemperature that allows the encapsulant to flow and also causes it tocure. The plates are held apart by a precise amount by adjustable stops704. After the encapsulant is cured the fixture is cooled. If a holdingvacuum is applied, then it is released along with the applied pressure,and the fixture plates are separated. The laminated part is then removedfrom the fixture plate and the low tack tape peeled from both sides.

FIG. 8A shows the module of FIG. 6 after removal of the low tackadhesive tape with permanent encapsulant 800 and optional stiffener 810.

FIGS. 7A and 7B show a fixture that maintains accurate thickness of theencapsulant, as well as allows the attachment of a stiffener. It shouldbe understood that conventional molding devices such as used to formelectronic packages could also be used. In addition, if the fixture ofFIGS. 7A and 7B is contained in a vacuum and the forcing devices aremade pneumatic or otherwise remotely actuated, then the encapsulant maybe degassed before the upper and lower plates of the fixture are forcedtogether.

Removal of Process Carrier

With reference to FIG. 8A, at this point the process carrier 481 isremoved. This can be accomplished by lapping the glass process carrierand continuing lapping partially into the adhesive 482 until theredistribution pads (466, 468, 470, 474), and thermal slugs (472, 476,478) are exposed. Lapping equipment of various sizes is available fromLapmaster International of Mount Prospect, Ill. Lapping is carried outusing an alumina lap slurry such as WCA 20 available from Microabrasivesof Westfield, Mass. The panel is attached to a vacuum hold down diamondstop lap carrier also available from Lapmaster. The diamond stops areset to prevent lapping beyond the point where redistribution pads andthermal slugs are exposed. The lapping process proceeds by applying apressure in a five minute ramp to 2 psi, lapping then continues untilthe diamond stops are riding on the lapping wheel. Alternatively, theprocess carrier may be removed by fine grinding equipment which is alsoavailable from Lapmaster. Yet another alternative is to use backgrindingequipment such as used for back-grinding finished wafers to thin thewafers before they are diced and the dice put into packages. Suchequipment is available from Disco of Tokyo, Japan.

Note that the lapping or grinding process can yield a solder mask whichcan be used either to provide masking for application of solder bumps orfor solder land pads when the bumps are on another module, devicecomponent or circuit board. This solder mask feature is automaticallyprovided since the adhesive that was used to adhere the module to theprocess carrier still surrounds the land pads and thermal slugs. Asmentioned this material was chosen to be a high temperature materialsuch as epoxy which is ideal for solder mask applications.

Adding Solder Bumps to the Back Side

The final processing steps add the interconnect bumps to the bottom ofthe module. Solder paste is screen printed onto the exposed land padsand thermally conductive metal slugs. Stencil printing solder paste iswell known in the art. The assembly is placed into a reflow oven andheated on a rapid ramp to just above the melting point of the solderwhich melts the solder and forms bumps. The module panel is then cooled.

FIG. 9A shows the cell phone in a package module with a chips-first baselayer 900, through connects 420 from top to bottom in thefiller/encapsulant 450, redistribution interconnect (467, 468, 469, 470,472, 473, 474, 475, 476, 465, 466), bumps 912 on the bottom masked bysolder mask 910 formed when the adhesive is lapped into the land pads, asecond layer of surface mounted modules 670, 680 and components 690, andan encapsulant 800 and optional stiffener 810.

Although only one module has been shown in many of the figures, themodules are processed in a large panel that holds many modules. At thispoint the panel can be singulated into individual modules using a dicingsaw. Dicing saws available for this application are available from DiscoCorp of Tokyo, Japan. This completes the fabrication of one embodimentof the electronic system or subsystem in a package.

Variations of the Process

There are several variations of the process as described which lead todifferent and novel structures.

No Stiffener or No Encapsulant

In the section that describes Adding Encapsulant and Stiffener, and withreference to FIGS. 7A and 7B, if no stiffener is laminated to the toplow tack tape, the result will be an encapsulated module withencapsulant 726 surrounding the second layer of components and a flatsurface of encapsulant for automated handling.

If it is desired to have the stiffener just bonded to some of the secondlayer components, then the stiffener can be coated with a low flowadhesive and no encapsulant 726 would be applied to the module side. Thebalance of the steps discussed above would be followed with the desiredresult.

No Second Layer Devices

If devices are not included in the second layer, a chips-first modulewith encapsulant, optional stiffener, and through connects, thermalslugs, backside connection and Faraday shielding capability isfabricated. The above steps are followed except those outlined in AddingDevices of the Second Layer. Modules with bumps 912 on the side awayfrom the active side of the chips have particular utility in systemswhere it is desired to electrically or thermally connect the back sideof the chip to the same circuit board where the I/O is connected. Such amodule is depicted as module 680 in FIG. 9A.

Accommodating Very Thick Second Layer Devices

If a hole is provided in the stiffener, a very thick component can beaccommodated without increasing the overall thickness of the resultantmodule. The thick component protrudes into the hole and the encapsulantis kept even with the top of the hole by the low tack tape. Some novelstructures that may be formed by this technique are given below.

If a surface mount connector is placed as one of the second leveldevices, then this connector may be accessed from the top of the moduleafter the module is mounted. This can allow connection, for example, ofan antenna or I/O device such as a keyboard. A photo optic sensor orsource may be surface mounted in such a way that direct interface to afiber optic cable may be effected. If a patch antenna is printed on thetop of the module, it may be connected by an embedded connector.

Temporary Encapsulant Structures

There are several innovative structures that are enabled by the use of atemporary encapsulant. The temporary encapsulant is applied at the samepoint in the process as the permanent encapsulant shown as 726 in FIG.7B. This gives the advantage that the remaining process may be followedand at the appropriate point in the process the encapsulant may beeasily removed to reveal the desired resulting module.

Stacked Modules

To fabricate a very thin module that can be stacked the same processingsteps as outlined above may be followed. Specifically, reference theabove discussion for Fabricating a Chips-First Base Layer, AddingRedistribution Interconnect, Attaching a Process Carrier and InitiatingProcessing of Top Side, and Adding the Interconnect Above the Chips.This processing results in the structure shown in FIG. 4N. FIG. 4N showsan embodiment that has had back side processing and has had two metalinterconnect layers (485, 486) (487, 488) and solder mask 494 applied tothe top side of the module. The solder mask is patterned with openings495 in the solder mask. Solder paste is now screen printed into openings495 and the module is reflowed in a solder reflow oven. Bumps arethereby formed on the top surface. Next, the steps outlined in AddingEncapsulant and Stiffener are performed, except that a temporaryencapsulant is used instead of the permanent one.

Using the temporary encapsulant results in the embodiment shown in FIG.8B. Aquabond A55 available from Semiconductor Equipment Corp. ofMoorpark, Calif., can be used as a temporary encapsulant 830. When thismaterial is heated to 90° C., it flows with a viscosity nearly that ofwater. At 90° C., it can be dispensed on top of the chips-first bumpedstructure described above, which is preferably preheated to 100° C. Thestiffener 840 is also coated by dispensing the heated liquid, temporaryencapsulant material on the preheated stiffener. For this embodiment, astiffener 840 may be a glass plate roughened on the encapsulant side.Both pieces are cooled to solidify the temporary encapsulant beforeassembly. As outlined in Adding Encapsulant and Stiffener, a low tacktape is laminated to the process carrier and to the stiffener. Theencapsulant molding fixture of FIGS. 7A and 7B is assembled and heatedwith the fixtures plates forced together as show in FIG. 7B. Thetemporary encapsulant flows to mold the encapsulant together with thestiffener. After cooling and removal of the low tack tape, the assemblyis as shown in FIG. 8B. FIG. 8B shows the module with temporaryencapsulant 830, stiffener 840, solder bumps 820 and with processcarrier 481 attached by adhesive 482.

The process carrier may be removed by following the steps in theabove-noted section Removal of Process Carrier. For clarity, these stepsare repeated here. Removal of the process carrier is accomplished bylapping the glass process carrier 481 and continuing lapping partiallyinto the adhesive 482 until the redistribution pads, and thermal slugsare exposed. Lapping is carried out on a (for example) a Lapmaster 36available form Lapmaster International of Mount Prospect, Ill., using analumina lap slurry such as WCA 20 available from Microabrasives ofWestfield, Mass. The panel is attached to a vacuum hold down diamondstop lap carrier also available from Lapmaster. The diamond stops areset to prevent lapping beyond the point where redistribution pads andthermal slugs are exposed. A pressure of 2 psi is applied by rampingfrom 0 psi over a 5 minute interval and lapping continues until thediamond stops are riding on the lapping wheel. Alternatively, theprocess carrier may be removed by fine grinding equipment available fromLapmaster or by back-grinding equipment typically used for back-grindingfinished wafers to thin the wafers before they are diced and the die putinto packages. Such equipment is available from Disco of Tokyo, Japan.

Note that the lapping or grinding process can yield a solder mask whichcan be used either to provide masking for application of solder bumps orfor solder land pads when the bumps are on another module, device,component or circuit board. This solder mask feature is automaticallyprovided since the adhesive that is used to adhere the module to theprocess carrier still surrounds the land pads and thermal slugs. Asnoted, this material is chosen to be a high temperature material, suchas epoxy which is ideal for solder mask applications.

FIG. 9B shows one embodiment of the resultant module. On the back side,the exposed lands 920 for solder or other interconnect are exposed onthe surface and surrounded by the residual adhesive that acts as asolder mask 910. To dice a panel into individual modules a dicing saw isused such as available from Disco Co. of Tokyo, Japan. The saw is set todice part way into the temporary encapsulant from the module side. Afterdicing is completed the panel is heated to 100° C. and individualmodules can be picked with a vacuum tool and placed in suitable washpack, such as available from Entegris Corp. of Chaska, Minn. The washingprocess may include dipping for a period of 10 minutes in 90° C. DIwater and surfactant, then 5 minutes in 90° C. DI water, then 1 minutein room temperature DI water, followed by propanol displacement dryingin hot propanol or propanol vapor dryer.

The module represented by Chip1, Chip2 and Chip3 is an example of astackable module (or multichip layer) that could be diced on the panel.The dicing lines 922 are shown in FIG. 9B. Note that there is nostiffener or encapsulant so these modules are fragile and in theirthinnest form are not practically capable of standing on their own.

FIG. 10A shows the Chip1, Chip2 and Chip3 module as diced and cleaned oftemporary encapsulant. Note that solder bumps 820 and land pads 920 arein alignment. As an example stack, this module is mounted to the baselayer of FIG. 4N in the location shown by the generic module 670 (seeFIG. 6). A first module can be mounted with its solder bumps to the landpads of the base layer. The assembly is then placed in an oven and thesolder is reflowed. A second module is then soldered to the land pads920 of the first module shown in FIG. 10A. This is accomplished bydipping the bumps of the second module in solder flux then placing thesecond module bumps onto the land pads of the first module. Again theassembly is placed in an oven to reflow the solder to make connection.The reflow may be done after each stacked module is added or the reflowprocess may be applied after the stack is completed. At this point, thepermanent encapsulant may be applied with or without the optionalstiffener and the process continued. Note that rigidity and robustprotection is afforded to the very thin stackable modules by theencapsulant. FIG. 10B shows a generic module 670 (such as shown in FIG.9A) as an exemplary stack of two of the modules 1000 as shown in FIG.10A. It should be noted that the stacked module disclosed herein is thethinnest module known that has bumps on one side and pads on the otherside, wherein both the pads and bumps are distributed above and belowthe chip or chips that are interconnected. A completely freestandingmodule with multiple stacked components may be attained where eachelement of the stack may be tested before assembly and where theresulting module is of minimal thickness.

Encapsulant Filler to Provide Stiffness

In cases where the filler/encapsulant is thicker than the chips, thefiller/encapsulant can supply a stiffening function. In the exampleembodiment of FIGS. 4N & 9B, Chip1 and Chip4 are thinner than the finalfiller/encapsulant 450. Modules that are formed using structuresassociated with Chip1 and Chip4 would result in filler/encapsulant thatis thicker than the chips. If the filler/encapsulant is thick enough itcan provide a stiffening function and eliminate the need for a stiffenerin the top side. Specifically, area 451 (FIG. 4M) on the back of Chip1is the area of encapsulant 450 that is thicker than Chip1. Theprocessing would proceed until the assembly reaches the point shown byFIG. 8B, where in the encapsulant is a temporary encapsulant 830. Theprocess carrier is now removed by lapping techniques disclosed above.The module is heated to 100° C. and the rigid stiffening member 840 isremoved. The module is now cleaned by soaking for 10 minutes in a 5%surfactant DI water solution at 90° C. followed by a rinse in 90° C. DIwater. This is followed by a rinse for 1 minute in DI water and apropanol water displace for drying. The resultant module would have noencapsulant or stiffener, but would obtain sufficient rigidity from thethick filler/encapsulant shown as area 451.

Chips Completely Surrounded by Copper

With reference to FIG. 6, the module formed around Chip5 is one that hascopper 446 surrounding the back and sides of the chip. As stated, thisis of value in fabricating very low inductance connection to the backside of the chip. It also provides a heat path from the back and sidesof the chip to the top of the module. Finally, it provides highconductivity shielding around the chip. In addition, this particularstructure configuration doesn't allow filler/encapsulant 450 to contactthe chip.

Complete System in a Package With Second Layer Devices on Back ofChips-First Base

In another embodiment, the second layer of devices is interconnected onthe back of the chips-first module, and bumps on the top of the moduleare used for input/output. FIG. 11 shows one embodiment of thisstructure. This configuration can be advantageous in digital systemswhere the chips-first base layer contains chips that have a significantamount of I/O. In such systems, having the I/O contacts on the backwould require that the through connections pass through the chips-firstbase layer. For large amounts of interconnect this could increase thesize of the module. In such cases putting the second layer devices onthe side away from the active area of the chips allows efficientredistribution of the large I/O compliment on the same side as the padsof the high I/O content chips.

To fabricate a module according to this embodiment the steps below arefollowed. First a chips-first base layer is fabricated as described inFabrication of Chips-first Base Layer. Next, the redistributioninterconnect is fabricated on the back side as described in AddingRedistribution Interconnect. This is followed by the steps contained inthe section entitled Attaching the Process Carrier and InitiatingProcessing of the Top Side. Next, the interconnect is added above thechips. This process follows the steps described in the section Addingthe Interconnect Above the Chips. The optional embodiment that providessolder landing pads and no solder mask is fabricated. The module at thispoint is shown in FIG. 4O. At this point, the processing departssomewhat from that already disclosed.

Adding Second Process Carrier

In the above-described embodiments, processing is carried out to add thesecond layer devices or add solder bumps. In this embodiment, a secondprocess carrier is attached to the just finished interconnect layersabove the chips. The steps are very similar to those described inAttaching Process Carrier & Initiating Processing of Top Side, but willbe repeated here in order to avoid confusion.

The second process carrier is (in one embodiment) a plain glass panelthat has been slightly roughened on one side to improve adhesion. Thetop surface of the module 499 as shown in FIG. 4O is pre-coated with alayer of adhesive. In one embodiment, a high temperature material suchas an epoxy that can be cured at or near room temperature is used. Thismaterial is coated to a thickness of between 12 and 50 microns by spinor spray coating. The material is cured until solid, but not completelycured. An epoxy that cures in 24 hours at room temperature is coated andthen baked on a hot plate for 30 minutes at 75° C. to achieve this solidbut not fully cured objective.

Next, each of the process carrier 1 of module 499 and process carrier 2are bonded by low adhesion tape into open frames. Such a process is wellknow in the art for the purpose of holding wafers when they are diced bya dicing saw. A frame bonder that is suitable for this use and also thelow tack tape is sold by Semiconductor Equipment Corp. of Moorpark,Calif. The process carrier frame is then placed on a fixture that holdsthe frame in alignment and thereby holds the process carrier inalignment. The same high temperature, liquid epoxy adhesive is thenapplied to the center of the process carrier 2. The process carrier 1frame is placed on the same fixture such that two untaped surfaces faceone another. The fixture is then placed into a laminating press andpressure is applied. This squeezes the adhesive into a thin uniform filmand bonds the process carrier 2 to the top of the partially processedchips-first base. The actual glue line thickness is primarily dictatedby the thickness of the pre-applied coating. After the adhesive hascured, the fixture is removed from the laminating press and the low tacktape is removed. The low tack tape and frame thus serve the dual purposeof holding alignment and also containing any run off of the adhesive.FIGS. 5A and 5B show the lamination fixture used to attach a processcarrier to a partially processed module. FIG. 12A shows process carrier2 1200 attached with adhesive 1202 to the partially processed base layer499.

Removing First Process Carrier

Still referring to FIG. 12A, the first process carrier 481 is removed bythe steps outlined in Removal of Process Carrier. This process isrepeated below for clarity. Removal of first process carrier 481 can beaccomplished by lapping the glass process carrier and continuing lappingpartially into adhesive 482 until the redistribution pads (468, 470,474, 466), and thermal slugs (478, 472, 476) are exposed. By way ofexample, lapping is carried out on a Lapmaster 36 using an alumina lapslurry such as WCA 20. The lapper is available form LapmasterInternational of Mount Prospect, Ill., and the WCA 20 is available fromMicroabrasives Co. of Westfield, Mass. The panel is attached to a vacuumhold down diamond stop lap carrier also available from Lapmaster. Thediamond stops are set to prevent lapping beyond the point whereredistribution pads and thermal slugs are exposed. A pressure of 2 psiis applied in a five minute ramp and lapping continues until the diamondstops are riding on the lapping wheel. Alternatively, the processcarrier may be removed by fine grinding equipment also available fromLapmaster. Another alternative is backgrinding which typically is usedfor back-grinding finished wafers to thin the wafers before they arediced and the die put into packages. Such equipment is available fromDisco Co. of Tokyo, Japan.

Note that the lapping or grinding process can yield a solder mask, whichcan be used either to provide masking for application of solder bumps orfor solder land pads when the bumps are on another module, devicecomponent or circuit board. This solder mask feature is automaticallyprovided since the adhesive that is used to adhere the module to theprocess carrier still surrounds the land pads and thermal slugs. Asmentioned, this material is chosen to be a high temperature materialsuch as epoxy which is ideal for solder mask applications. FIG. 12Bshows process carrier 1 removed and the redistribution pads 1210 andthermal slugs 1212, 1214, 1216, exposed, with the residual adhesive 482acting as a solder mask.

Adding Devices of the Second Layer to the Backside of Chips-First Base

The components of the second layer are next added. This process issimilar to the process described in Adding Devices of the Second Layerwhere components are added to the top of the chips-first base. Theprocess discussion is repeated here to avoid confusion. First solderpaste is screen printed onto the base layer over land pads (1210, 1212,1214, 1216). Stencil printing solder paste is well known in the art. Thesecond layer devices 670, 680 are placed with their bumps or pads intothe solder paste. The assembly is placed into a reflow oven and heatedon a rapid ramp to just above the melting point of the solder, whichmelts the solder to complete the interconnection from the second layerdevices to the chips-first base layer. Under the thermal slug of secondlayer device 680, solder melts to provide an all metallic path orthermal conduit for heat flow from second layer device 680 through thestructural material of the chips-first base layer.

FIG. 12C shows the chips-first layer with second layer devices 670, 680attached electrically and thermally. Although one mode is to use solderto interconnect the chips-first base and second layer devices, it isalso possible using screen print conductive epoxy, for example, byplacing the bumps or pads of the second layer devices into theconductive epoxy and curing the conductive epoxy. Another method is todip the solder bumps of some or all of the second layer devices in fluxand place the devices bumps-down on the chips-first base. Solder pasteis not required where flux dipped bumps are used. The same reflow thatis used to reflow the solder paste can at the same time reflow bumpsthat are just flux dipped. This method is of value when stacks ofdevices are fabricated since it is difficult to print solder paste on anuneven surface. It should also be noted that the use of the highelongation low modulus dielectric on the chips-first base and/or thesecond layer devices allows the solder bumps to be extremely thin. Thisis because substantially all the strain is taken up in the dielectricand little strain is transmitted to the bumps. This allows the resultantstructure to be considerably thinner.

In the example embodiment, two bumped modules are shown as part of thesecond layer. It should be understood that there is a vast variety ofmodules that could be used, such as: chip scale packages, conventionalbumped packages and modules, stacked packages, bumped chips, SAW modulesand essentially any device that may be surface mounted to a circuitboard. Additionally, one of the incorporated modules could be asubsystem module that was previously fabricated according to thisdisclosure.

Adding Encapsulant and Stiffener to Bottom of Chips-First Base

In one embodiment, an encapsulant layer is next added to providemechanical rigidity to the module and to provide a flat surface forimproved handling by automated equipment. The encapsulant may be addedalone or with a rigid stiffening member or layer. Using a stiffener isadvantageous if the module is of minimum thickness since practicalencapsulants are not as stiff as practical stiffeners for a giventhickness. FIGS. 7A & 7B show a laminating fixture suitable for moldingencapsulant and bonding a stiffener to the multichip module. Theoperation of this fixture is explained in detail in the section entitledAdding Encapsulant and Stiffener.

Both the stiffener and chips-first module (i.e., multichip base layer)with second layer devices as shown in FIG. 12C, are laminated with lowadhesion tape. This is done to contain the encapsulant runoff Tapelamination can be done using a roll laminator from Think & Tinker, Ltd.of Palmer Lake, Colo., and low tack tape is available from SemiconductorEquipment Corp. of Moorpark, Calif. Encapsulant is applied to both thestiffener and the module. One encapsulant material which can be usedcontains a curing agent, and can be applied in liquid form, such as anepoxy or a urethane acrylate. Applying the material in liquid formallows it to run under the attached second layer modules and allowsentrapped air bubbles to flow out. (In an alternative embodiment,conventional underfill material is dispensed and allowed to flow underthe modules by capillary attraction. This underfill is cured before theencapsulant is applied. The use of underfill is well known in the art.)The encapsulant material is applied and dried. The stiffener is attachedto the upper plate of the fixture. This can be done by incorporatingvacuum hold down in the fixture plate or by applying a thin layer of lowtack adhesive or both. Similarly the module is attached to the bottom ofthe fixture. The top and bottom plates are assembled with the modulefacing up and the stiffener facing down. Pressure is applied to forcethe plates together, and the fixture is heated to a temperature thatallows the encapsulant to flow and also cause it to cure. After theencapsulant is cured, the fixture is cooled. If a vacuum is applied, itis released and the force is released, which is followed by the fixtureplates being separated. The laminated structure is then removed from thefixture plate and the low tack tape peeled from both sides.

FIG. 12D depicts the multichip module after removal of the low tackadhesive tape. Encapsulant 1250 surrounds modules 670 and 680 andattaches an optional stiffener 1252. FIGS. 7A & 7B show a fixture thatmaintains accurate thickness of the encapsulant as well as allowing theattachment of a stiffener. It should be understood that conventionalmolding devices such as used to form electronic packages could also beused. In addition, if the fixture of FIGS. 7A & 7B is contained in avacuum and the forcing devices shown are made pneumatic or otherwiseremotely actuated, then the encapsulant may be degassed before the upperand lower plates of the fixture are forced together.

Removal of Second Process Carrier

At this point, process carrier 2 1200 can be removed. The second processcarrier is removed by following the steps outlined in Removal of ProcessCarrier. This is again accomplished by lapping the glass process carrierand continuing lapping partially into the adhesive 1202 until theredistribution pads, and thermal slugs are exposed. Lapping can becarried out on a Lapmaster 36 using an alumina lap slurry such as WCA20. The panel is attached to a vacuum hold down diamond stop lapcarrier. The diamond stops are set to prevent lapping beyond the pointwhere redistribution pads and thermal slugs are exposed. A pressure of 2psi is applied as a ramp over a five minute interval and lapping iscontinued until the diamond stops are riding on the lapping wheel.Alternatively, the process carrier may be removed by fine grinding orback-grinding equipment.

Note that the lapping or grinding process can yield a solder mask whichcan be used either to provide masking for application of solder bumps orfor solder land pads when the bumps are on another module, device,component or circuit board. This solder mask feature is automaticallyprovided since the adhesive 1202 that was used to adhere the module tothe process carrier still surrounds the land pads 1130 and thermal sluglands 1131. As mentioned, this material was chosen to be a hightemperature material such as epoxy which is ideal for solder maskapplications.

Adding Solder Bumps to the Top Side

The final processing steps add the interconnect bumps to the top of themodule. This process is similar to that described in the sectionentitled Adding Solder Bumps to the Top Side, except that it is done onthe surface above the active surface of the chips. The process issummarized again to avoid confusion. Solder paste is screen printed ontothe exposed land pads 1130 and thermal slug pads 1131. Stencil printingsolder paste is well know in the art. The assembly is then placed into areflow oven and heated on a rapid ramp to just above the melting pointof the solder, which melts the solder and forms bumps 1120 (see FIG.11). The module panel is then cooled.

FIG. 11 shows the completed cell phone in a package multichip module,with a chips-first multichip layer 1000, through connects 420 from topto bottom in the filler/encapsulant (i.e., structural material),redistribution interconnect and land pads on the bottom 1102; a secondlayer of surface mounted modules 670, 680 and components attached to thebottom, an encapsulant 1110 and optional stiffener 1112 on the bottom,and I/O bumps 1120 on the top.

Although only one multichip module has been shown in many of thefigures, in practice the modules are processed in a large panel whichholds many modules. At this point, the panel would be singulated intoindividual multichip modules using a dicing saw. This completes thefabrication of another embodiment of the electronic system or subsystemin a package.

Further Variations

Other Types of Bumps

In each case where application of solder bumps is described above, theremay be alternatives to fabricating any type of bump or pad structuresuitable for the intended application. As an example, consider as astarting point the module of FIG. 4N, which shows solder mask 494 withopenings 495, 496 that expose underlying copper pads. Any kind of metalbump or pad may be fabricated by first sputtering a copper seed layerover the solder mask 494 and into the openings 495, 496, applying photoresist, patterning holes in the photo resist where the bumps/pads aredesired and plating up to the desired size of the bump/pad. This isfollowed by removal of the resist and etching the copper seed layer.This approach may be used, for example, to plate pads that have only athin coating of solder. When this type of module is assembled into asystem, the thickness of the system is reduced since the bump is quitethin. A bump of minimal height is especially effective when thedielectric below is of the low modulus, high elongation type such thatstress/strain on the solder interconnect itself is minimized. Inaddition, the use of pure copper bumps for interconnection is well knownin the art.

Other Types of Process Carriers and Their Removal

In each case where the use of a process carrier is described, theprocess carrier is adhesively attached and subsequently removed bylapping or grinding. Other types of process carrier removal may also beused. For example, using a process carrier that is transparent to laserlight, the carrier may be removed by, for example, excimer laser pulsesthrough the carrier that vaporize a small portion of the adhesive, thusseparating the process carrier. Additionally, other techniques includingusing a process carrier with a solventable layer and solvent removingthe carrier, or using one with a melting point above the previousprocessing temperatures and heating above this melting point andremoving the carrier may be employed.

Although specific embodiments of the present invention have beenillustrated in the accompanying drawings and described in the foregoingdetailed description, it will be understood that the invention is notlimited to the particular embodiments described herein, but is capableof numerous rearrangements, modifications and substitutions withoutdeparting from the spirit of the invention, and these are thereforeconsidered to be within the scope of the invention as defined in thefollowing claims.

1. A method of bonding two structures, comprising: applying an adhesiveof controlled thickness to a first surface of a first structure; atleast partially curing the adhesive of controlled thickness; applyingadditional adhesive to at least one of the at least partially curedadhesive applied to the first surface of the first structure or to asecond surface of a second structure; holding the first structure andthe second structure in alignment with the first surface and the secondsurface thereof disposed in spaced, opposing relation; applying a forceto at least one of the first structure or the second structure tosqueeze the additional adhesive between the second surface and the atleast partially cured adhesive applied to the first surface to reduce athickness of the additional adhesive; and at least partially curing theadditional adhesive to bond the first structure and the second structuretogether.
 2. The method of claim 1, wherein the holding comprises tapingthe first structure into a first frame and taping the second structureinto a second frame, and holding the first frame in alignment to thesecond frame.
 3. The method of claim 2, wherein the holding of the firstframe in alignment to the second frame comprises aligning the firstframe to the second frame employing one or more alignment elements. 4.The method of claim 3, wherein the one or more alignment elementscomprise one or more alignment pins, which during the holding extendperpendicular between and couple the first frame and the second frametogether.
 5. The method of claim 1, wherein applying the force furthercomprises employing a laminating press in applying the force to at leastone of the first structure or the second structure to squeeze theadditional adhesive between the second surface and the at leastpartially cured adhesive applied to the first surface to reduce thethickness of the additional adhesive.
 6. The method of claim 1, whereinthe adhesive and the additional adhesive are the same type of adhesivematerial.
 7. The method of claim 1, wherein the adhesive and theadditional adhesive each comprise an epoxy material.
 8. The method ofclaim 1, wherein one of the first structure or the second structure is acircuit structure, and the other of the first structure or the secondstructure is a substrate.
 9. The method of claim 8, wherein the firststructure is the circuit structure, the circuit structure comprising abase layer including: at least one electrically conductive structure,each electrically conductive structure comprising at least one sidesurface, an upper surface and a lower surface; a structural materialsurrounding and physically contacting the at least one side surface ofeach electrically conductive structure of the at least one electricallyconductive structure, the structural material having an upper surfacesubstantially coplanar with or parallel to an upper surface of eachelectrically conductive structure of the at least one electricallyconductive structure and defining at least a portion of a front surfaceof the base layer, and a lower surface substantially coplanar with orparallel with a lower surface of each electrically conductive structureof the at least one electrically conductive structure and defining atleast a portion of a back surface of the base layer; and wherein thefirst surface of the first structure comprises one of the back surfaceof the base layer, a surface over the back surface of the base layer ora surface over the front surface of the base layer.
 10. The method ofclaim 8, wherein the first structure is the circuit structure, thecircuit structure comprising a chip layer including: at least one chip,each chip comprising at least one side surface, an upper surface and alower surface; a structural material surrounding and physicallycontacting the at least one side surface of each chip of the at leastone chip, the structural material having an upper surface substantiallycoplanar with or parallel to an upper surface of each chip of the atleast one chip and defining at least a portion of a front surface of thechip layer, and a lower surface substantially coplanar with or parallelto a lower surface of each chip of the at least one chip and defining atleast a portion of a back surface of the chip layer; and wherein thefirst surface of the first structure comprises one of the back surfaceof the chip layer, a surface over the back surface of the chip layer ora surface over the front surface of the chip layer.
 11. The method ofclaim 8, wherein the first structure is the circuit structure, thecircuit structure comprising a chip layer including: at least one chip,each chip comprising at least one side surface, an upper surface, and alower surface; a structural material surrounding and physicallycontacting the at least one side surface of each chip of the at leastone chip of the chip layer, the structural material having an uppersurface substantially coplanar with or parallel to an upper surface ofeach chip of the at least one chip and defining at least a portion of afront surface of the chip layer, and a lower surface substantiallycoplanar with or parallel to a lower surface of each chip of the atleast one chip and defining at least a portion of a back surface of thechip layer; and at least one conductive structure extending through thestructural material, and wherein the first surface of the firststructure comprises one of the back surface of the chip layer, a surfaceover the back surface of the chip layer or a surface over the frontsurface of the chip layer.
 12. The method of claim 1, wherein theapplying comprises applying an epoxy adhesive of controlled thickness tothe first surface of the first structure.
 13. The method of claim 12,wherein the applying comprises applying a liquid epoxy adhesive ofcontrolled thickness to the first surface of the first structure. 14.The method of claim 13, wherein the applying of the additional adhesivecomprises applying additional liquid epoxy adhesive to a center of theat least partially cured adhesive applied to the first surface of thefirst substrate or to a center of the second surface of the secondstructure, and wherein applying the force comprises pressing theadditional adhesive into a thin uniform film.
 15. The method of claim 1,wherein applying the force comprises pressing the additional adhesiveinto a thin uniform film, with the resultant adhesive thickness betweenthe spaced, opposing first surface and second surface being principallyequal to the controlled thickness of the at least partially curedadhesive on the first surface of the first structure.